Designing an integrated circuit (IC) for communication, computing, gaming, and other emerging applications is a multi-million dollar project, requiring rigorous design methodology and substantial ...

As the semiconductor industry is moving towards lower technology nodes, more and more complexity is being introduced in the design to beat the competition and provide most innovative solution to cater ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

2.5D/3D IC designs present new challenges in both ESD design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs.

“This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD ...

The state-of-the-art in robustness design and analysis for ESD (electrostatic discharge) always lags our ability to characterize and qualify a device or system. The ESD Association, IEC, JEDEC, and ...