FormFactor has introduced DC-Boost, an advanced TRE test technology to increase probe test capacity. The new wafer-probe-card capability enables more efficient use of tester channels on test equipment ...

New market study finds that the top six manufacturers of Wafer Test Probe Card occupied nearly 72.09% global market share. LEWES, DELAWARE, UNITED STATES, November 30 ...

Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

Device test times also are rising dramatically. Longer test times are driven by higher levels of embedded memory, higher functionality, higher quality requirements, and the need to move more tests to ...

In a heterogeneous integrated system, the impact of composite yield fallout due to a single chiplet is creating new performance imperatives for wafer test in terms of test complexity and coverage.

System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,... STAr ...