Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...