Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...
AMD has been granted a patent (12080632) that covers glass core substrate technology. For those who came in late, glass substrates, made from materials like borosilicate, quartz, and fused silica, ...
TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
Sumitomo Chemical Chairman Keiichi Iwata (left) and Samsung Electro-Mechanics President Duckhyun Chang sign an MOU. The joint venture MOU is part of a strategy to overcome the limitations of package ...
Epitaxial growth is a fundamental process in semiconductor manufacturing. It refers to depositing a thin, crystal layer on a crystal substrate, with a specific orientation. This layer closely ...
“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...
Sony Semiconductor Solutions Corp. has claimed the first stacked CMOS image sensor technology with a 2-layer transistor pixel. The company’s proprietary technology separates photodiodes and pixel ...
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