A research team led by German research center Forschungszentrum Jülich GmbH has proposed to use direct wire bonding (DWB) as a low-temperature method for interconnecting finger-free heterojunction ...
Solyco is developing a new low-temperature technology for the interconnection of solar cells. It consists of a round copper core with a diameter of 280 μm that is covered by a very thin layer of ...
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