Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
image: Researchers from the University of Tsukuba have produced a record-breaking polycrystalline germanium (Ge) thin film on a flexible polyimide substrate. Tuning the growth temperature and ...
Polyimide resins are known for their thermal stability, durability, and resistance to a range of solvents and chemicals. Combined with their excellent dielectric properties, these polymers possess ...
A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...
This article is part of the TechXchange: PCB Tools and Technology. Many manufacturers still use the standard FR-4 material for their rigid boards because FR-4 materials are cost-efficient and highly ...
AUSTIN, Texas--(BUSINESS WIRE)--3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic ...
In a study published in RSC: Applied Polymers, Thomas J. Wallin of MIT, Chen Wang of the University of Utah, and seven other researchers introduced a novel flexible substrate material. This material ...
(Nanowerk News) Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, ...
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