After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...

Surfx's Dr. Robert Hicks takes us on a journey of discovery around atmospheric plasma and its potential to revolutionize semiconductor packaging. Could you provide an overview of Surfx Technologies as ...

A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

Space Forge has positioned itself as a specialist in off‑planet manufacturing, building satellites designed not just to ...

The Global Semiconductor Etch Equipment Market revenue was USD 22730 Million in 2022 and is forecast to a readjusted size of USD 49330 Million by 2029 with a CAGR of 11.2% during the forecast period ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...