A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties.

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

Taiwan-based IC lead frame maker Chang Wah Technology (CWTC) expects to gain momentum for its automotive product segment in 2024, driven by major achievements in car chip developments... Taiwan-based ...

Custom-designed, photochemically etched surface-mount and insert-mount lead frames for integrated circuit manufacturing are now available. The frame’s base materials include Kovar, nickel-iron alloys, ...