Business Wire

Seoul Semiconductor Seeks Greater Market Share in Global High-Power LED Market Valued at USD 2 Billion With Innovative WICOP LED Technology

ANSAN, South Korea--(BUSINESS WIRE)--Seoul Semiconductor Co., Ltd. (KOSDAQ 046890), a leading global innovator of LED products and technology, announced that it has introduced high-power LED package ...
EDN

Samsung introduces LED components based on chip-scale packaging technology

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
Business Wire

Samsung Heats Up Indoor Lighting Market with 6W and 8W Chip-on-Board LED Packages

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package products, the LC006B and LC008B ...
EDN

The three Ps of LED driver selection: power, package, and performance

Advances in technology have resulted in LEDs with exceptional lumen output and years of reliable operation. All LED lighting systems — regardless of the size and complexity of the luminaire design — ...
Semiconductor Engineering

High Performance, Multi-Chip Leadframe Package With Internal Connections

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...