Portable 3D optical inspection with 4Di InSpec transforms surface metrology, enhancing defect detection and quality assurance ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

Abstract: A next generation system and methodology for high-throughput e-beam hot spot inspection is described. Rather than capturing images of each hot spot, just a single pixel centered on the ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

A new solution deposition process for semiconductors yields high-performing transistors by introducing more defects, counterintuitively. Researchers used these devices to construct high- speed logic ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Micro-LED display driven with CuIn5Se8 transistors processed by solution deposition. The LEDs are inorganic making them hard to operate without the power available from devices made with the new ...