PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) here today announced it has licensed proprietary pillar-bumped technology from Singapore-based Advanpack Solutions Pte. Ltd. for flip ...
SAN MATEO, Calif. — Fujitsu Ltd. and two subsidiaries, Fujitsu Tohoku Electronics Ltd. and Fujitsu Microelectronics Inc. (FMI), will expand production of wafer bumping and flip-chip ball-grid-array ...
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