PLEASANTON, Calif. — Advanced Interconnect Technologies Inc. (AIT) here today announced it has licensed proprietary pillar-bumped technology from Singapore-based Advanpack Solutions Pte. Ltd. for flip ...
Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FPBGA) packaging technology to Siliconware Precision Industries Ltd., a contract ...
Samsung Electronics has confirmed that it is preparing for the trial production of flip-chip ball grid array (FC-BGA) in Vietnam and plans to start mass production in July 2023 at its factory in Thai ...
Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...
Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
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