As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...

TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced packaging has become ...

Design innovations play a key role in the evolution of clean manufacturing, especially in the area of packaging. All of clean manufacturing’s top goals, from waste minimization to energy efficiency to ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated that the computing ...

Higgins provided guidance for the December quarter, stating, "Total revenue is expected to be $3.225 billion, plus or minus $150 million." Foundry/logic revenue is forecasted to be about 59% and ...