Advanced CMOS process technologies enable IC designers to deliver higher performing devices, but also increase the need for extra board-level ESD protection to ensure the reliability of the end ...
IC cores have shrunk significantly with ever-smaller process geometries, but the I/Os have basically been stuck at the same sizes since 0.5-micron CMOS. Now with new compact electrostatic discharge ...
In the semiconductor manufacturing industry, damage and yield losses attributed to the effects of static charges are well documented along with the determination of many of the specific causes. 1 If ...
ESD or electro-static discharge induced field failures for integrated circuits (IC) has always been an challenge. Literature survey indicates that as high as 35% of total chip field failures are ESD ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
ICs subjected to electrostatic discharge (ESD) stress have distinct failure signatures. High currents can melt different regions of the semiconductor structure (ESD-HBM, or human body model), while ...
BELGIUM – October 21, 2025 – Sofics BV, a world leading solution provider specializing in physical layout and design, with a focus on the built-in robustness of integrated circuits that demand ...
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