Designing an integrated circuit (IC) for communication, computing, gaming, and other emerging applications is a multi-million dollar project, requiring rigorous design methodology and substantial ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

“This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD ...

2.5D/3D IC designs present new challenges in both ESD design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs.

The state-of-the-art in robustness design and analysis for ESD (electrostatic discharge) always lags our ability to characterize and qualify a device or system. The ESD Association, IEC, JEDEC, and ...