Researchers have revived and improved a once-reliable technique to identify and count defects in transistors, the building blocks of modern electronic devices such as smartphones and computers.

As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

(Nanowerk News) Structural defects that form during additive manufacturing, also known as 3D printing, are a barrier to some applications of this technology. Researchers used diagnostic tools and ...

Residential building defects have emerged as a critical concern for the construction industry worldwide, impacting both economic outcomes and occupant well‐being. Contemporary research has underlined ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Whether the discussion is about smart manufacturing or digital transformation, one of the biggest conversations in the semiconductor industry today centers on the tremendous amount of data fabs ...

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection tools’ resolution and throughput at foundries and OSATs. However, defects ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

Longitudinal (top) and axial (middle) images of X-Ray CT data of parts with 6 internal defects: a spherical clog, a stellated shaped clog, a cone shaped void, a blob shaped void, an elliptical warp of ...