Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...
As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...
Venice, Florida — SoftJin, introduced NxDAT, a tool for the analysis of defects identified by mask inspection systems. The software includes features for defect navigation, visual display, defect ...
Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...
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