Korean researchers have developed a new analysis method capable of detecting “hidden defects” in semiconductors with a ...

Veryon has been named a winner in the 2026 BIG Innovation Awards for Veryon AIRE, its AI-powered data intelligence platform, ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...

Pipeline defect analysis and assessment remains a critical area of research, given its direct impact on the safety and reliability of energy transportation infrastructures. Mechanical defects such as ...

Optical 3D metrology enables fast, non-contact surface roughness measurement of defects and roughness for precise ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Semiconductors are used in devices such as memory chips and solar cells, and within them may exist invisible defects that ...

SEMVision™ H20 enables better and faster analysis of nanoscale defects in leading-edge chips Second-generation “cold field emission” technology provides high-resolution imaging AI image recognition ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...