SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ...
ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a growing AI-driven market. December 23, 2025-- ASMPT (HKEX: 0522), the world’s ...
With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has intensified, driving ...
As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to ...
A new technical paper titled “Hybrid Bonding with Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography” was published by researchers at Seoul National University of Science and ...
Thermo-compression processing optimizes Cu/SiC composites, improving strength and toughness by improving particle ...
Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...
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