IZMO successfully designs 3D System-in-Package (SiP) module for Space Payload Camera Electronics

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Izmo shares jump 5% as arm develops 3D SiP module for space electronics

By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
Business Wire

CES 2020: pmdtechnologies to Showcase New 3D VGA ToF Module

SIEGEN, Germany & LAS VEGAS--(BUSINESS WIRE)--On schedule with CES 2020, pmdtechnologies is presenting its latest 3D Time-of-Flight camera module, based on the 5th generation REAL3™ ToF image sensor ...
Design Engineering

Vision Components to present VC MIPI IMX454 Multispectral Camera Module at Photonics West

Vision Components (VC) will present its new VC MIPI IMX454 Camera Module at SPIE Photonics West, taking place from January ...
Business Wire

Top 5 Vendors in the Automotive Camera Module Market - COVID Impact | Technavio

LONDON--(BUSINESS WIRE)--COVID-19 market impact analysis anticipates Negative and Inferior growth for the automotive camera module market, while 33% of the market’s growth will originate from Europe ...