TE Connectivity recently unveiled its extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded socket technologies.
The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...
Many electronic devices are produced modularly, connecting printed circuits using special connectors. Samtec supplies this type of sockets in various universal formats, suitable for THT and SMT ...
TE Connectivity (TE), formerly Tyco Electronics, has developed a surface-mount LGA 2011 socket specifically for Intel Corp's Core i7 and Xeon 5 CPU processors. The contacts of TE's new LGA 2011 socket ...
Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...
Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...
Serving the role of connecting a device and its tester, test sockets—also known as package probes—play a crucial interconnect role in integrated circuits (IC), and therefore the greater field of ...
Upgrading CPUs in office computers makes a great deal of sense given that while CPU technology has advanced greatly, other components live longer lives before they become obsolete. Upgrading poses a ...
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